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★ 中科院硬科技成果 📍 Guicheng, Nanhai

Guangdong Casmicro Laser Technology Co., Ltd.

Picosecond & Femtosecond Ultrafast Laser Micromachining for Glass & Semiconductor Wafers

Payload / Capacity Pulse: < 350 fs
Precision / Repeatability Kerf: < 5 µm
Protection / Rating Cleanroom 1000
Standard Lead Time 30-45 Days

Company & Manufacturing Overview

Spin-off from Chinese Academy of Sciences in Nanhai Guicheng specializing in ultrafast femtosecond lasers.

Key Equipment & Machinery Lineup

  • Femtosecond Glass Drilling Machine
  • SiC Semiconductor Wafer Dicer
  • Ultrafast Deburring Station

Proven Shopfloor Deployment Cases

Smartwatch Microcrystalline Ceramic Laser Dicing Line

💰 Chipping edge <3µm, yield boosted from 76% to 99.4%